Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736045 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Stephen H. Black | 2014-05-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736045 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Stephen H. Black | 2014-05-27 |