Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410760 | Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together | Jay R. Neumann, Thomas F. McEwan, David E. Sigurdson, Alberto Martin Perez, Janine F. Lambe | 2019-09-10 |
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian | 2017-07-18 |
| 9334154 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian | 2016-05-10 |
| 9323130 | Thermal control in variable aperture mechanism for cryogenic environment | Jeffrey P. Yanevich, Michael L. Brest, Kenneth L. McAllister, James E. Scroggin, Julio C. Dominguez | 2016-04-26 |
| 7675066 | Erase-on-demand memory cell | Thomas K. Dougherty, Tricia Veeder, Stephen A. Gabelich, John J. Drab | 2010-03-09 |