Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349475 | Integrated circuit having vertical routing to bond pads | Eric R. Miller, Christian Boemler, Justin Gordon Adams Wehner, Drew Fairbanks | 2025-07-01 |
| 12278255 | Thin film obscurant for microelectronics | Michael K. Burkland, Peter A. Bellus | 2025-04-15 |
| 12261186 | Mosaic focal plane array | David J. Gulbransen, Eric R. Miller, Matthew D. Chambers, Eric J. Beuville, Andrew E. Gin +1 more | 2025-03-25 |
| 12148721 | Iterative formation of damascene interconnects | Eric R. Miller, Michael V. Liguori, Michael J. Rondon | 2024-11-19 |
| 12051712 | Close butted collocated variable technology imaging arrays on a single ROIC | George Grama, Scott S. Miller | 2024-07-30 |
| 11886095 | Scalable unit cell device for large two-dimensional arrays with integrated phase control | Christopher Casimir Brough, Richard E. Wahl, Thomas R. Yengst, Justin Gordon Adams Wehner | 2024-01-30 |
| 11837623 | Integrated circuit having vertical routing to bond pads | Eric R. Miller, Christian Boemler, Justin Gordon Adams Wehner, Drew Fairbanks | 2023-12-05 |
| 11750945 | Imager with integrated asynchronous laser pulse detection having a signal component along a second electrical pathway passes through an ALPD readout integrated circuit to an imaging readout integrated circuit | Adam M. Kennedy, Michael J. Batinica, Scott M. Taylor, Paul Bryant | 2023-09-05 |
| 11710756 | Integrating optical elements with electro-optical sensors via direct-bond hybridization | Jamal I. Mustafa, Robert C. Anderson, John L. Vampola, Eric R. Miller, George Grama | 2023-07-25 |
| 11705471 | Close butted collocated variable technology imaging arrays on a single ROIC | George Grama, Scott S. Miller | 2023-07-18 |
| 11430753 | Iterative formation of damascene interconnects | Eric R. Miller, Michael V. Liguori, Michael J. Rondon | 2022-08-30 |
| 11393869 | Wafer level shim processing | Jeffery H. Burkhart, Eric R. Miller | 2022-07-19 |
| 11222813 | Method of manufacturing wafer level low melting temperature interconnections | Eric R. Miller, George Grama | 2022-01-11 |
| 10879291 | Stacked sensor with integrated capacitors | Neil R. Malone, Micky R. Harris | 2020-12-29 |
| 10847419 | Stress compensation and relief in bonded wafers | Scott S. Miller, Christine Frandsen, Andrew Cahill, Shannon F. Wilkey | 2020-11-24 |
| 10847569 | Wafer level shim processing | Jeffery H. Burkhart, Eric R. Miller | 2020-11-24 |
| 10672826 | Segmented channel stop grid for crosstalk mitigation in visible imaging arrays | John L. Vampola, George Paloczi | 2020-06-02 |
| 10515837 | Method of wafer bonding of dissimilar thickness die | Eric R. Miller | 2019-12-24 |
| 10504777 | Method of manufacturing wafer level low melting temperature interconnections | Eric R. Miller, George Grama | 2019-12-10 |
| 10418406 | Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit | John L. Vampola, Barry M. Starr, Chad W. Fulk, Christopher L. Mears, John J. Drab | 2019-09-17 |
| 10236226 | In-situ calibration structures and methods of use in semiconductor processing | Robert M. Emerson, Michael V. Liguori | 2019-03-19 |
| 9100545 | Image device having a plurality of detectors in a time delay and integration (TDI) configuration and associated method | John L. Vampola, William H. Frye | 2015-08-04 |
| 8294232 | High quantum efficiency optical detectors | John L. Vampola, Robert E. Mills, Kenton Veeder | 2012-10-23 |
| 6472126 | Photonic device having an integral guide and method of manufacturing | Robert F. Traver, Jr., Theodore Lowes, Mark Donhowe | 2002-10-29 |
| 6151430 | Photonic device having an integal guide and method of manufacturing | Robert F. Traver, Jr., Theodore Lowes, Mark Donhowe | 2000-11-21 |