Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051712 | Close butted collocated variable technology imaging arrays on a single ROIC | Sean P. Kilcoyne, Scott S. Miller | 2024-07-30 |
| 11851785 | Aluminum nitride passivation layer for mercury cadmium telluride in an electrical device | Andrew Clarke, David R. Rhiger, Stuart B. Farrell | 2023-12-26 |
| 11710756 | Integrating optical elements with electro-optical sensors via direct-bond hybridization | Jamal I. Mustafa, Robert C. Anderson, John L. Vampola, Sean P. Kilcoyne, Eric R. Miller | 2023-07-25 |
| 11705471 | Close butted collocated variable technology imaging arrays on a single ROIC | Sean P. Kilcoyne, Scott S. Miller | 2023-07-18 |
| 11410937 | Semiconductor device with aluminum nitride anti-deflection layer | Andrew Clarke, Michael J. Rondon | 2022-08-09 |
| 11222813 | Method of manufacturing wafer level low melting temperature interconnections | Sean P. Kilcoyne, Eric R. Miller | 2022-01-11 |
| 11101130 | Method of filling grooves and holes in a substrate | Andrew Clarke, Robert M. Emerson, June-Marie Boll | 2021-08-24 |
| 10515905 | Semiconductor device with anti-deflection layers | Michael J. Rondon, Andrew Clarke | 2019-12-24 |
| 10504777 | Method of manufacturing wafer level low melting temperature interconnections | Sean P. Kilcoyne, Eric R. Miller | 2019-12-10 |
| 9209380 | Acoustic wave device | Suzanne Combe, Kurt G. Steiner, Alan S. Chen, Charles E. Carpenter, Ian Y. K. Yee +1 more | 2015-12-08 |
| 9166548 | Acoustic wave filter manufacturing method using photo-definable epoxy for suppression of unwanted acoustic energy | Suzanne Combe, Rodolfo E. Chang | 2015-10-20 |
| 7800281 | Acoustic wave filters using photo-definable epoxy for suppression of unwanted acoustic energy | Suzanne Combe, Rodolfo E. Chang | 2010-09-21 |
| 7635636 | Wafer level packaging of materials with different coefficients of thermal expansion | Michael T. McClure, Jack Chocola, Kevin Lin | 2009-12-22 |
| 7596849 | Method of assembling a wafer-level package filter | Charles E. Carpenter, Kevin Lin | 2009-10-06 |
| 7109635 | Wafer level packaging of materials with different coefficients of thermal expansion | Michael T. McClure, Jack Chocola, Kevin Lin | 2006-09-19 |
| 5874848 | Electric current sensor utilizing a compensating trace configuration | William A. Drafts | 1999-02-23 |