Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7635636 | Wafer level packaging of materials with different coefficients of thermal expansion | Michael T. McClure, Kevin Lin, George Grama | 2009-12-22 |
| 7230512 | Wafer-level surface acoustic wave filter package with temperature-compensating characteristics | Charles E. Carpenter, Kevin Lin, Phillip Welsh | 2007-06-12 |
| 7213314 | Method of forming a surface acoustic wave (SAW) filter device | Benjamin Paul Abbott, Svetlana Malocha, Gary Monetti, Joshua Zepess | 2007-05-08 |
| 7109635 | Wafer level packaging of materials with different coefficients of thermal expansion | Michael T. McClure, Kevin Lin, George Grama | 2006-09-19 |
| 7105980 | Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics | Benjamin Paul Abbott, Svetlana Malocha, Gary Monetti, Josh Zepress | 2006-09-12 |