Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level packaging of materials with different coefficients of thermal expansion

Wafer level packaging of materials with different coefficients of thermal expansion

US Patent 7109635 · Granted Sep 19, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Devices, systems, and methods for virtual bulk density sensing2025
Close butted collocated variable technology imaging arrays on a single ROIC2024
Aluminum nitride passivation layer for mercury cadmium telluride in an electrica2023
Integrating optical elements with electro-optical sensors via direct-bond hybrid2023
Close butted collocated variable technology imaging arrays on a single ROIC2023
Methods for inter-system carrier aggregation in advanced wireless communication 2023
Semiconductor device with aluminum nitride anti-deflection layer2022
Method of manufacturing wafer level low melting temperature interconnections2022
Method of filling grooves and holes in a substrate2021
Methods for inter-system carrier aggregation in advanced wireless communication 2021
System and method for data communication2021
System and method for data communication2020