Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer-level surface acoustic wave filter package with temperature-compensating characteristics

Wafer-level surface acoustic wave filter package with temperature-compensating characteristics

US Patent 7230512 · Granted Jun 12, 2007

Estimated economic value: $3,200,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Devices, systems, and methods for virtual bulk density sensing2025
Compartmentalized shielding of a module utilizing self-shielded sub-modules2025
Electronic device with solder interconnect and multiple material encapsulant2025
Methods for inter-system carrier aggregation in advanced wireless communication 2023
Methods for inter-system carrier aggregation in advanced wireless communication 2021
System and method for data communication2021
Surface acoustic wave (SAW) device with antireflective structure2021
System and method for data communication2020
Methods for inter-system carrier aggregation in advanced wireless communication 2020
System and method for data communication2019
Methods for inter-system carrier aggregation in advanced wireless communication 2018
Wireless communications system and method in a wireless communications system2018