Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847419 | Stress compensation and relief in bonded wafers | Scott S. Miller, Christine Frandsen, Sean P. Kilcoyne, Shannon F. Wilkey | 2020-11-24 |
| 10475664 | Wafer stacking to form a multi-wafer-bonded structure | Jonathan Getty, Daniel D. Lofgreen, Paul A. Drake | 2019-11-12 |
| 10300649 | Enhancing die flatness | Sean F. Harris, Daniel D. Lofgreen | 2019-05-28 |
| 6384458 | Semiconductor system for registering spectra, color signals, color signals, color images and the like | Michael Bode, Manfred Schierjott | 2002-05-07 |