Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508684 | Structure for bonding and electrical contact for direct bond hybridization | Jonathan Getty, Alexandra Miller | 2022-11-22 |
| 10475664 | Wafer stacking to form a multi-wafer-bonded structure | Andrew Cahill, Jonathan Getty, Paul A. Drake | 2019-11-12 |
| 10300649 | Enhancing die flatness | Andrew Cahill, Sean F. Harris | 2019-05-28 |