Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low-dielectric constant structure with a multilayer stack of thin films with pores

Low-dielectric constant structure with a multilayer stack of thin films with pores

US Patent 7196422 · Granted Mar 27, 2007

Estimated economic value: $11,700,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer-level-packaged BAW devices with surface mount connection structures2019
Stealth-dicing compatible devices and methods to prevent acoustic backside refle2018
Formation of dielectric with smooth surface2018
Methods of providing dielectric to conductor adhesion in package structures2017
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric 2016
Methods of providing dielectric to conductor adhesion in package structures2015
Ferroelectric polymer memory module2012
Ferroelectric polymer memory module2010
Method of reducing the surface roughness of spin coated polymer films2010
Laminating magnetic materials in a semiconductor device2010
Forming ferroelectric polymer memories2010
Polymer memory with adhesion layer containing an immobilized metal2010