Issued Patents All Time
Showing 26–50 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7557438 | Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same | Rajashree Baskaran | 2009-07-07 |
| 7550901 | Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same | Ioan Sauciuc | 2009-06-23 |
| 7545030 | Article having metal impregnated within carbon nanotube array | Thomas Dory, James G. Maveety, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu | 2009-06-09 |
| 7538476 | Multi-layer piezoelectric actuators with conductive polymer electrodes | Ioan Sauciuc | 2009-05-26 |
| 7537954 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, Sarah Kim, R. Scott List | 2009-05-26 |
| 7508671 | Computer system having controlled cooling | Ioan Sauciuc, Ravi Mahajan | 2009-03-24 |
| 7499278 | Method and apparatus for dissipating heat from an electronic device | Ioan Sauciuc, Ward Scott | 2009-03-03 |
| 7487822 | Micro-chimney and thermosiphon die-level cooling | James G. Maveety | 2009-02-10 |
| 7471515 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment | Je-Young Chang | 2008-12-30 |
| 7457116 | Method and system to cool memory | Hakan Erturk, Ioan Sauciuc | 2008-11-25 |
| 7449780 | Apparatus to minimize thermal impedance using copper on die backside | Fay Hua, James G. Maveety, Kramadhati V. Ravi | 2008-11-11 |
| 7435623 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon | Ravi Prasher | 2008-10-14 |
| 7432532 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Abhay Watwe, Sairam Agraharam, Kramadhati V. Ravi, Michael C. Garner | 2008-10-07 |
| 7430870 | Localized microelectronic cooling | David Chau | 2008-10-07 |
| 7397119 | Wafer-level diamond spreader | Chuan Hu | 2008-07-08 |
| 7367195 | Application and removal of thermal interface material | Ioan Sauciuc | 2008-05-06 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body | Fay Hua, Thomas J. Fitzgerald, Carl Deppisch | 2008-04-22 |
| 7348665 | Liquid metal thermal interface for an integrated circuit device | Ioan Sauciuc | 2008-03-25 |
| 7335983 | Carbon nanotube micro-chimney and thermo siphon die-level cooling | James G. Maveety, Unnikrishnan Vadakkanmaruveedu | 2008-02-26 |
| 7336487 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant | Paul J. Gwin, David Chau | 2008-02-26 |
| 7317615 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment | Je-Young Chang | 2008-01-08 |
| 7279796 | Microelectronic die having a thermoelectric module | Chuan Hu, Ravi Mahajan | 2007-10-09 |
| 7259965 | Integrated circuit coolant microchannel assembly with targeted channel configuration | Je-Young Chang, Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Ravi Prasher +3 more | 2007-08-21 |
| 7243705 | Integrated circuit coolant microchannel with compliant cover | Alan M. Myers, Je-Young Chang, Ravi Prasher, Ioan Sauciuc, Patrick D. Boyd +1 more | 2007-07-17 |
| 7218519 | Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels | Ravi Prasher | 2007-05-15 |