Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309924 | Connection structure embedded substrate and substrate structure including the same | Tae Hong Min, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee, Chi Won Hwang | 2025-05-20 |
| 11737211 | Connection structure embedded substrate and substrate structure including the same | Tae Hong Min, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee, Chi Won Hwang | 2023-08-22 |
| 11659665 | Connection structure embedded substrate | Won Seok Lee, Jae-Sung Sim | 2023-05-23 |
| 11430737 | Flexible printed circuit board with embedded electronic element | Sa Yong Lee, Ju Ho Kim | 2022-08-30 |
| 11076488 | Board having electronic component embedded therein | Jae-Sung Sim | 2021-07-27 |
| 10939556 | Electronic component embedded substrate | Jae-Sung Sim, Won Seok Lee | 2021-03-02 |
| 10932368 | Substrate-embedded electronic component | Ha Yong Jung, Jae-Sung Sim, Won Seok Lee | 2021-02-23 |
| 9907182 | Method of manufacturing insulation film and printed circuit board | Hwa Young Lee, Jae-Kul Lee, Ok-Seon Yoon | 2018-02-27 |