Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2018-10-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2016-05-03 |
| 6974726 | Silicon wafer with soluble protective coating | Ashay Dani, Gudbjorg H. Oskarsdottir, Chris Matayabas, Sujit Sharan, Chris Rumer | 2005-12-13 |