Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7347354 | Metallic solder thermal interface material layer and application of the same | Edward P. Hurley, Rod Christner, Tim Renfro | 2008-03-25 |
| 7242088 | IC package pressure release apparatus and method | Sudipto Neogi, Biswajit Sur, Boon Seng Tan | 2007-07-10 |
| 7220624 | Windowed package for electronic circuitry | Sudipto Neogi, Biswajit Sur, Boon Seng Tan | 2007-05-22 |
| 6974726 | Silicon wafer with soluble protective coating | Ashay Dani, Gudbjorg H. Oskarsdottir, Chris Matayabas, Sujit Sharan, Beverly J. Canham | 2005-12-13 |