Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Windowed package for electronic circuitry

Windowed package for electronic circuitry

US Patent 7220624 · Granted May 22, 2007

Estimated economic value: $18,006,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microwave integrated quantum circuits with cap wafers and their methods of manuf2025
Microwave integrated quantum circuits with cap wafers and their methods of manuf2023
Microwave integrated quantum circuits with cap wafers and their methods of manuf2021
Adaptive thermal control of electronic devices2015
Thermally downward scalable system2015
Metallic solder thermal interface material layer and application of the same2008
IC package pressure release apparatus and method2007
IC package pressure release apparatus and method2007
IC package pressure release apparatus and method2007
IC package pressure release apparatus and method2007
Ultra-thin polarization mode converters based on liquid crystal materials2007
Diamond heat spreading and cooling technique for integrated circuits2006