Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12207569 | Microwave integrated quantum circuits with cap wafers and their methods of manufacture | Jayss Daniel Marshall, Chih Yang Li, Nagesh Vodrahalli, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more | 2025-01-21 |
| 11770982 | Microwave integrated quantum circuits with cap wafers and their methods of manufacture | Jayss Daniel Marshall, Chih Yang Li, Nagesh Vodrahalli, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more | 2023-09-26 |
| 11121301 | Microwave integrated quantum circuits with cap wafers and their methods of manufacture | Jayss Daniel Marshall, Chih Yang Li, Nagesh Vodrahalli, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more | 2021-09-14 |
| 9218041 | Adaptive thermal control of electronic devices | Thomas E. Walsh, Ajay Gupta, Brian C. Kluge, Kristoffer Fleming | 2015-12-22 |
| 9176550 | Thermally downward scalable system | Eric Distefano, James G. Hermerding, II, Eugene P. Matter, John P. Wallace, Guy M. Therien | 2015-11-03 |
| 7242088 | IC package pressure release apparatus and method | Sudipto Neogi, Boon Seng Tan, Chris Rumer | 2007-07-10 |
| 7220624 | Windowed package for electronic circuitry | Sudipto Neogi, Boon Seng Tan, Chris Rumer | 2007-05-22 |
| 7174060 | Ultra-thin polarization mode converters based on liquid crystal materials | Nagesh Vodrahalli, Achintya Bhowmik, Connie Chunling Liu, Takaharu Fujiyama, Kenji Takahashi | 2007-02-06 |
| 7132313 | Diamond heat spreading and cooling technique for integrated circuits | Michael O'Connor, Kevin Haley | 2006-11-07 |
| 7091063 | Electronic assembly comprising solderable thermal interface and methods of manufacture | Nagesh Vodrahalli, Thomas Workman | 2006-08-15 |
| 7065273 | Wideband arrayed waveguide grating | Achintya Bhowmik | 2006-06-20 |
| 6982192 | High performance thermal interface curing process for organic flip chip packages | Nagesh Vodrahalli | 2006-01-03 |
| 6928200 | Ultra-thin polarization mode converters based on liquid crystal materials | Nagesh Vodrahalli, Achintya Bhowmik, Connie Chunling Liu, Takaharu Fujiyama, Kenji Takahashi | 2005-08-09 |
| 6860642 | Compact optical package with modular optical connector | Nagesh Vodrahalli, Jaiom S. Sambyal | 2005-03-01 |
| 6724078 | Electronic assembly comprising solderable thermal interface | Nagesh Vodrahalli, Thomas Workman | 2004-04-20 |
| 6667548 | Diamond heat spreading and cooling technique for integrated circuits | Michael O'Connor, Kevin Haley | 2003-12-23 |