Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
BS

Biswajit Sur — 16 Patents

Intel: 13 patents #3,167 of 30,777Top 15%
RCRigetti & Co: 3 patents #33 of 69Top 50%
San Jose, CA: #4,110 of 32,062 inventorsTop 15%
California: #37,952 of 386,348 inventorsTop 10%
Overall (All Time): #284,196 of 4,157,543Top 7%
16 Patents All Time
Biswajit Sur has been granted 16 US patents while listed as an inventor at Intel. The first was granted in 2003 and the most recent in January 2025. Biswajit Sur ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Biswajit Sur in San Jose, CA, US.

Patents per Year

Patents granted per year, 2003 to 2025Bar chart with a peak of 4 patents in 2006.peak 42003: 1 patents20032004: 1 patents20042005: 2 patents20052006: 4 patents20062007: 3 patents20072015: 2 patents20152021: 1 patents20212023: 1 patents20232025: 1 patents2025

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12207569 Microwave integrated quantum circuits with cap wafers and their methods of manufacture Jayss Daniel Marshall, Chih Yang Li, Nagesh Vodrahalli, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more 2025-01-21
11770982 Microwave integrated quantum circuits with cap wafers and their methods of manufacture Jayss Daniel Marshall, Chih Yang Li, Nagesh Vodrahalli, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more 2023-09-26
11121301 Microwave integrated quantum circuits with cap wafers and their methods of manufacture Jayss Daniel Marshall, Chih Yang Li, Nagesh Vodrahalli, Mehrnoosh Vahidpour, William Austin O'Brien, IV +3 more 2021-09-14
9218041 Adaptive thermal control of electronic devices Thomas E. Walsh, Ajay Gupta, Brian C. Kluge, Kristoffer Fleming 2015-12-22 $19,949,000
9176550 Thermally downward scalable system Eric Distefano, James G. Hermerding, II, Eugene P. Matter, John P. Wallace, Guy M. Therien 2015-11-03 $14,434,000
7242088 IC package pressure release apparatus and method Sudipto Neogi, Boon Seng Tan, Chris Rumer 2007-07-10 $14,625,000
7220624 Windowed package for electronic circuitry Sudipto Neogi, Boon Seng Tan, Chris Rumer 2007-05-22 $18,006,000
7174060 Ultra-thin polarization mode converters based on liquid crystal materials Nagesh Vodrahalli, Achintya Bhowmik, Connie Chunling Liu, Takaharu Fujiyama, Kenji Takahashi 2007-02-06 $13,917,000
7132313 Diamond heat spreading and cooling technique for integrated circuits Michael O'Connor, Kevin Haley 2006-11-07 $13,207,000
7091063 Electronic assembly comprising solderable thermal interface and methods of manufacture Nagesh Vodrahalli, Thomas Workman 2006-08-15 $13,533,000
7065273 Wideband arrayed waveguide grating Achintya Bhowmik 2006-06-20 $13,743,000
6982192 High performance thermal interface curing process for organic flip chip packages Nagesh Vodrahalli 2006-01-03 $22,757,000
6928200 Ultra-thin polarization mode converters based on liquid crystal materials Nagesh Vodrahalli, Achintya Bhowmik, Connie Chunling Liu, Takaharu Fujiyama, Kenji Takahashi 2005-08-09 $18,014,000
6860642 Compact optical package with modular optical connector Nagesh Vodrahalli, Jaiom S. Sambyal 2005-03-01 $28,008,000
6724078 Electronic assembly comprising solderable thermal interface Nagesh Vodrahalli, Thomas Workman 2004-04-20 $26,995,000
6667548 Diamond heat spreading and cooling technique for integrated circuits Michael O'Connor, Kevin Haley 2003-12-23 $55,491,000