{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package", "item": "https://www.patentleaderboard.com/patent/9299602"}]}

Home › Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package

Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package

US Patent 9299602 · Granted Mar 29, 2016

Estimated economic value: $14,056,000 ⓘ

Assignee

Intel

Inventors

Qinglei Zhang (21 patents)
Tao Wu (28 patents)
Mark S. Hlad (20 patents)
Charavana K. Gurumurthy (9 patents)

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