Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9102512 | Sealed MEMS devices with multiple chamber pressures | Li Chen, Kuang L. Yang | 2015-08-11 |
| 9105644 | Apparatus and method for forming alignment features for back side processing of a wafer | William D. Sawyer, Thomas Kieran Nunan | 2015-08-11 |
| 8956904 | Apparatus and method of wafer bonding using compatible alloy | John R. Martin, Timothy J. Frey, Michael Judy | 2015-02-17 |
| 8507306 | Reduced stiction MEMS device with exposed silicon carbide | Li Chen, Thomas Kieran Nunan, Kuang L. Yang | 2013-08-13 |
| 8507913 | Method of bonding wafers | Thomas Kieran Nunan, Changhan Hobie Yun | 2013-08-13 |
| 8304861 | Substrate bonding with bonding material having rare earth metal | John R. Martin, Timothy J. Frey | 2012-11-06 |
| 8293582 | Method of substrate bonding with bonding material having rare Earth metal | John R. Martin, Timothy J. Frey | 2012-10-23 |
| 8288191 | Apparatus and method of wafer bonding using compatible alloy | John R. Martin, Timothy J. Frey | 2012-10-16 |
| 8268724 | Alternative to desmear for build-up roughening and copper adhesion promotion | Houssam Jomaa | 2012-09-18 |
| 8183692 | Barrier layer for fine-pitch mask-based substrate bumping | Ravi Kiran Nalla, Mark S. Hlad | 2012-05-22 |
| 7981765 | Substrate bonding with bonding material having rare earth metal | John R. Martin, Timothy J. Frey | 2011-07-19 |
| 7943411 | Apparatus and method of wafer bonding using compatible alloy | John R. Martin, Timothy J. Frey | 2011-05-17 |
| 7776734 | Barrier layer for fine-pitch mask-based substrate bumping | Ravi Kiran Nalla, Mark S. Hlad | 2010-08-17 |
| 7638877 | Alternative to desmear for build-up roughening and copper adhesion promotion | Houssam Jomaa | 2009-12-29 |