| 11107766 |
Substrate with embedded stacked through-silicon via die |
Javier Soto Gonzalez |
2021-08-31 |
$22,590,000 |
| 10804195 |
High density embedded interconnects in substrate |
Kuiwon Kang, Marcus HSU, Brigham NAVAJA |
2020-10-13 |
$32,150,000 |
| 10651160 |
Low profile integrated package |
Kuiwon Kang, Christopher Bahr, Layal Rouhana |
2020-05-12 |
$14,443,000 |
| 10622292 |
High density interconnects in an embedded trace substrate (ETS) comprising a core layer |
Kuiwon Kang |
2020-04-14 |
$17,407,000 |
| 10461032 |
Substrate with embedded stacked through-silicon via die |
Javier Soto Gonzalez |
2019-10-29 |
$25,165,000 |
| 10157824 |
Integrated circuit (IC) package and package substrate comprising stacked vias |
Kuiwon Kang, Layal Rouhana, Seongryul Choi |
2018-12-18 |
$7,478,000 |
| 9941158 |
Integrated circuit and process for fabricating thereof |
Charan Gurumurthy, Islam A. Salama, Ravi Tanikella |
2018-04-10 |
$20,820,000 |
| 9929097 |
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers |
Ravi Kiran Nalla, Omar J. Bchir |
2018-03-27 |
$21,620,000 |
| 9679841 |
Substrate and method of forming the same |
Omar J. Bchir, Kuiwon Kang, Chin-Kwan Kim |
2017-06-13 |
$7,359,000 |
| 9609751 |
Package substrate comprising surface interconnect and cavity comprising electroless fill |
Omar J. Bchir, Chin-Kwan Kim |
2017-03-28 |
$5,956,000 |
| 9559088 |
Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same |
Javier Soto Gonzalez |
2017-01-31 |
$9,360,000 |
| 9536805 |
Power management integrated circuit (PMIC) integration into a processor package |
Siamak Fazelpour, Jiantao Zheng, Mario Francisco Velez, Sun Hyuck Yun, Rajneesh Kumar |
2017-01-03 |
$8,174,000 |
| 9460980 |
Systems, apparatus, and methods for heat dissipation |
Sun Woong Yun, Rajneesh Kumar, Joan Rey Villarba BUOT |
2016-10-04 |
$10,096,000 |
| 9398699 |
Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
Omar J. Bchir |
2016-07-19 |
$7,217,000 |
| 9355898 |
Package on package (PoP) integrated device comprising a plurality of solder resist layers |
Rajneesh Kumar, David Fraser Rae, Layal Rouhana, Omar J. Bchir |
2016-05-31 |
$7,978,000 |
| 9269681 |
Surface finish on trace for a thermal compression flip chip (TCFC) |
Omar J. Bchir, Milind Shah, Manuel Aldrete, Chin-Kwan Kim |
2016-02-23 |
$9,167,000 |
| 9040842 |
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers |
Ravi Kiran Nalla, Omar J. Bchir |
2015-05-26 |
$20,586,000 |
| 8802556 |
Barrier layer on bump and non-wettable coating on trace |
Omar J. Bchir, Milind Shah, Manuel Aldrete, Chin-Kwan Kim |
2014-08-12 |
$7,886,000 |
| 8736065 |
Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same |
Javier Soto Gonzalez |
2014-05-27 |
$13,313,000 |
| 8555494 |
Method of manufacturing coreless substrate |
— |
2013-10-15 |
$19,695,000 |
| 8421245 |
Substrate with embedded stacked through-silicon via die |
Javier Soto Gonzalez |
2013-04-16 |
$28,862,000 |
| 8276269 |
Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
Omar J. Bchir |
2012-10-02 |
$10,164,000 |
| 8268724 |
Alternative to desmear for build-up roughening and copper adhesion promotion |
Christine H. Tsau |
2012-09-18 |
$22,462,000 |
| 8067266 |
Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication |
— |
2011-11-29 |
$19,402,000 |
| 8017022 |
Selective electroless plating for electronic substrates |
Omar J. Bchir, Islam A. Salama |
2011-09-13 |
$15,671,000 |
