Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381174 | Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods | Aniket PATIL, Hong Bok We | 2025-08-05 |
| 12362269 | Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods | Michelle Yejin Kim, Kuiwon Kang, Ching-Liou Huang | 2025-07-15 |
| 12230552 | Recess structure for padless stack via | Hong Bok We, Aniket PATIL | 2025-02-18 |
| 12100645 | Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods | Aniket PATIL, Hong Bok We | 2024-09-24 |
| 12021063 | Circular bond finger pad | Aniket PATIL, Zhijie Wang, Hong Bok We | 2024-06-25 |
| 11955409 | Substrate comprising interconnects in a core layer configured for skew matching | Aniket PATIL, Hong Bok We | 2024-04-09 |
| 11832391 | Terminal connection routing and method the same | Aniket PATIL, Hong Bok We | 2023-11-28 |
| 11804645 | Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods | Hong Bok We, Aniket PATIL | 2023-10-31 |
| 11791276 | Package comprising passive component between substrates for improved power distribution network (PDN) performance | Aniket PATIL, Hong Bok We | 2023-10-17 |
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Michelle Yejin Kim, Kuiwon Kang, Aniket PATIL | 2023-10-17 |
| 11764076 | Semi-embedded trace structure with partially buried traces | Kuiwon Kang, Terence Cheung | 2023-09-19 |
| 11676905 | Integrated circuit (IC) package with stacked die wire bond connections, and related methods | Kuiwon Kang, Michelle Yejin Kim, Jialing Tong | 2023-06-13 |
| 11581251 | Package comprising inter-substrate gradient interconnect structure | Aniket PATIL, Zhijie Wang, Hong Bok We | 2023-02-14 |
| 11562962 | Package comprising a substrate and interconnect device configured for diagonal routing | Aniket PATIL, Zhijie Wang, Hong Bok We | 2023-01-24 |
| 11342254 | Multi-dielectric structure in two-layer embedded trace substrate | Kuiwon Kang, Joonsuk Park, Karthikeyan Dhandapani | 2022-05-24 |
| 11322490 | Modular capacitor array | Zhijie Wang | 2022-05-03 |
| 11302656 | Passive device orientation in core for improved power delivery in package | Hong Bok We, Aniket PATIL, Zhijie Wang | 2022-04-12 |
| 11296022 | Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape | Aniket PATIL, Hong Bok We | 2022-04-05 |
| 9460980 | Systems, apparatus, and methods for heat dissipation | Sun Woong Yun, Rajneesh Kumar, Houssam Jomaa | 2016-10-04 |
| 8317107 | Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same | Christian Orias | 2012-11-27 |
| 8093717 | Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same | Christian Orias | 2012-01-10 |
| 7262492 | Semiconducting device that includes wirebonds | Ruel Pieda, Carmelito Libay | 2007-08-28 |