Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit and process for fabricating thereof

Integrated circuit and process for fabricating thereof

US Patent 9941158 · Granted Apr 10, 2018

Estimated economic value: $20,820,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic device with embedded die substrate on interposer2024
Device and method of very high density routing used with embedded multi-die inte2024
Device and method of very high density routing used with embedded multi-die inte2024
Microelectronic device with embedded die substrate on interposer2024
Embedded multi-die interconnect bridge packages with lithographically formed bum2023
Methods to pattern TFC and incorporation in the ODI architecture and in any buil2023
Substrate patch reconstitution options2023
Device and method of very high density routing used with embedded multi-die inte2022
Microelectronic device with embedded die substrate on interposer2022
Substrate with embedded stacked through-silicon via die2021
Embedded multi-die interconnect bridge packages with lithotgraphically formed bu2021
High density embedded interconnects in substrate2020