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2022-07-19 |
| 10410971 |
Thermal and electromagnetic interference shielding for die embedded in package substrate |
Hong Bok We, Christopher J. Healy, Chin-Kwan Kim |
2019-09-10 |
| 10163687 |
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Lizabeth Keser, Reynante Tamunan Alvarado |
2018-12-25 |
| 9985010 |
System, apparatus, and method for embedding a device in a faceup workpiece |
Lizabeth Keser, Reynante Tamunan Alvarado |
2018-05-29 |
| 9806048 |
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Lizabeth Keser, Reynante Tamunan Alvarado |
2017-10-31 |
| 9679873 |
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Lizabeth Keser, Piyush Gupta |
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| 9601472 |
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| 9601435 |
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| 9484327 |
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2016-11-01 |
| 9355898 |
Package on package (PoP) integrated device comprising a plurality of solder resist layers |
Rajneesh Kumar, Houssam Jomaa, Layal Rouhana, Omar J. Bchir |
2016-05-31 |