Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670599 | Package comprising passive device configured as electromagnetic interference shield | Jeahyeong Han, Rajneesh Kumar | 2023-06-06 |
| 11502049 | Package comprising multi-level vertically stacked redistribution portions | Aniket PATIL, Hong Bok We | 2022-11-15 |
| 11404343 | Package comprising a substrate configured as a heat spreader | John Holmes, Marcus HSU, Kuiwon Kang, Avantika Sodhi | 2022-08-02 |
| 11393808 | Ultra-low profile stacked RDL semiconductor package | Aniket PATIL, Hong Bok We | 2022-07-19 |
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | Hong Bok We, Christopher J. Healy, Chin-Kwan Kim | 2019-09-10 |
| 10163687 | System, apparatus, and method for embedding a 3D component with an interconnect structure | Lizabeth Keser, Reynante Tamunan Alvarado | 2018-12-25 |
| 9985010 | System, apparatus, and method for embedding a device in a faceup workpiece | Lizabeth Keser, Reynante Tamunan Alvarado | 2018-05-29 |
| 9806048 | Planar fan-out wafer level packaging | Lizabeth Keser, Reynante Tamunan Alvarado | 2017-10-31 |
| 9679873 | Low profile integrated circuit (IC) package comprising a plurality of dies | Lizabeth Keser, Piyush Gupta | 2017-06-13 |
| 9601472 | Package on package (POP) device comprising solder connections between integrated circuit device packages | Lizabeth Keser | 2017-03-21 |
| 9601435 | Semiconductor package with embedded components and method of making the same | Chin-Kwan Kim, Rajneesh Kumar, Milind Shah, Omar J. Bchir | 2017-03-21 |
| 9484327 | Package-on-package structure with reduced height | Chin-Kwan Kim, Omar J. Bchir, Milind Shah, Marcus HSU | 2016-11-01 |
| 9355898 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Rajneesh Kumar, Houssam Jomaa, Layal Rouhana, Omar J. Bchir | 2016-05-31 |