Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417622 | Flip-chip device | Yangyang SUN, Xuefeng Zhang, Dongming He | 2022-08-16 |
| 11404343 | Package comprising a substrate configured as a heat spreader | David Fraser Rae, Marcus HSU, Kuiwon Kang, Avantika Sodhi | 2022-08-02 |
| 10002857 | Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer | Michael James Solimando, William Stone, Christopher J. Healy, Rajendra D. Pendse, Sun Hyuck Yun | 2018-06-19 |
| 4612104 | Electrochemical cell | Roderick W. Froud | 1986-09-16 |