Dongming He — 18 Patents at Qualcomm

Dongming He has been granted 18 US patents while listed as an inventor at Qualcomm. The first was granted in 2003 and the most recent in December 2025. Dongming He ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Dongming He in San Diego, CA, US.

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Showing 1–18 of 18 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12500188	Flip-chip bumping metal layer and bump structure	Jun Chen, Yanhua Sun, Lily Zhao, Ahmer Syed	2025-12-16
12113038	Thermal compression flip chip bump for high performance and fine pitch	Hung-Yuan Hsu, Yangyang SUN, Wei Hu, Wei Wang, Lily Zhao	2024-10-08	$22,809,000
11948909	Package comprising spacers between integrated devices	Yangyang SUN, Lily Zhao	2024-04-02	$17,562,000
11721656	Integrated device comprising pillar interconnect with cavity	Yujen CHEN, Hung-Yuan Hsu	2023-08-08	$10,348,000
11694982	Sidewall wetting barrier for conductive pillars	Wei Hu, Wen Yin, Zhe Guan, Lily Zhao	2023-07-04
11557557	Flip-chip flexible under bump metallization size	Yangyang SUN, Lily Zhao	2023-01-17	$15,190,000
11437335	Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods	Kuiwon Kang, Aniket PATIL, Bohan Yan	2022-09-06	$16,070,000
11417622	Flip-chip device	Yangyang SUN, John Holmes, Xuefeng Zhang	2022-08-16	$29,107,000
9607777	Separator and electrochemical device	Sheng Cheng, Shaojun NIU, Xiaowen Zhang	2017-03-28
9406649	Stacked multi-chip integrated circuit package	Zhongping Bao, Zhenyu Huang	2016-08-02	$10,911,000
8963339	Stacked multi-chip integrated circuit package	Zhongping Bao, Zhenyu Huang	2015-02-24	$8,767,000
7656035	C4 joint reliability	Sairam Agraharam, Carlton Hanna, Vasudeva Atluri, Debendra Mallik, Matthew Escobido +1 more	2010-02-02	$16,667,000
7626251	Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same	Daoqiang Lu, Chuan Hu	2009-12-01	$24,844,000
7517787	C4 joint reliability	Sairam Agraharam, Carlton Hanna, Vasudeva Atluri, Debendra Mallik, Matthew Escobido +1 more	2009-04-14	$13,316,000
7465651	Integrated circuit packages with reduced stress on die and associated methods	Sairam Agraharam, Carlton Hanna, Vasudeva Atluri	2008-12-16	$21,903,000
7251389	Embedded on-die laser source and optical interconnect	Daoqiang Lu, Bruce A. Block	2007-07-31	$23,850,000
6989586	Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems	Sairam Agraharam, Carlton Hanna, Vasudeva Atluri	2006-01-24	$23,406,000
6573734	Integrated thin film liquid conductivity sensor	Mark A. Shannon	2003-06-03

Dongming He — 18 Patents

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