Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Hung-Yuan Hsu, Yangyang SUN, Wei Hu, Wei Wang, Lily Zhao | 2024-10-08 |
| 11948909 | Package comprising spacers between integrated devices | Yangyang SUN, Lily Zhao | 2024-04-02 |
| 11721656 | Integrated device comprising pillar interconnect with cavity | Yujen CHEN, Hung-Yuan Hsu | 2023-08-08 |
| 11694982 | Sidewall wetting barrier for conductive pillars | Wei Hu, Wen Yin, Zhe Guan, Lily Zhao | 2023-07-04 |
| 11557557 | Flip-chip flexible under bump metallization size | Yangyang SUN, Lily Zhao | 2023-01-17 |
| 11437335 | Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods | Kuiwon Kang, Aniket PATIL, Bohan Yan | 2022-09-06 |
| 11417622 | Flip-chip device | Yangyang SUN, John Holmes, Xuefeng Zhang | 2022-08-16 |
| 9607777 | Separator and electrochemical device | Sheng Cheng, Shaojun NIU, Xiaowen Zhang | 2017-03-28 |
| 9406649 | Stacked multi-chip integrated circuit package | Zhongping Bao, Zhenyu Huang | 2016-08-02 |
| 8963339 | Stacked multi-chip integrated circuit package | Zhongping Bao, Zhenyu Huang | 2015-02-24 |
| 7656035 | C4 joint reliability | Sairam Agraharam, Carlton Hanna, Vasudeva Atluri, Debendra Mallik, Matthew Escobido +1 more | 2010-02-02 |
| 7626251 | Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same | Daoqiang Lu, Chuan Hu | 2009-12-01 |
| 7517787 | C4 joint reliability | Sairam Agraharam, Carlton Hanna, Vasudeva Atluri, Debendra Mallik, Matthew Escobido +1 more | 2009-04-14 |
| 7465651 | Integrated circuit packages with reduced stress on die and associated methods | Sairam Agraharam, Carlton Hanna, Vasudeva Atluri | 2008-12-16 |
| 7251389 | Embedded on-die laser source and optical interconnect | Daoqiang Lu, Bruce A. Block | 2007-07-31 |
| 6989586 | Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems | Sairam Agraharam, Carlton Hanna, Vasudeva Atluri | 2006-01-24 |
| 6573734 | Integrated thin film liquid conductivity sensor | Mark A. Shannon | 2003-06-03 |