| 12398998 |
Methods for high-resolution, stable measurement of pitch and orientation in optical gratings |
Jinxin FU, Ludovic Godet |
2025-08-26 |
|
| 12386155 |
Ultra-wide angle lens systems with external pupil |
Wubin PANG, Jinxin FU, Samarth Bhargava |
2025-08-12 |
|
| 12379280 |
Method of measuring efficiency for optical devices |
Jinxin FU, Kazuya Daito, Ludovic Godet |
2025-08-05 |
|
| 12355000 |
Package comprising a substrate and a high-density interconnect integrated device |
Li-Sheng Weng, Zhimin Song |
2025-07-08 |
|
| 12236575 |
In-line metrology systems, apparatus, and methods for optical devices |
Jinxin FU, Kazuya Daito, Ludovic Godet |
2025-02-25 |
|
| 12229940 |
In-line metrology systems, apparatus, and methods for optical devices |
Jinxin FU, Kazuya Daito, Ludovic Godet |
2025-02-18 |
|
| 12203747 |
Interference in-sensitive Littrow system for optical device structure measurement |
Jinxin FU, Ludovic Godet |
2025-01-21 |
|
| 12165341 |
Optical resolution measurement method for optical devices |
Jinxin FU, Ludovic Godet |
2024-12-10 |
$69,596,000 |
| 12113038 |
Thermal compression flip chip bump for high performance and fine pitch |
Dongming He, Hung-Yuan Hsu, Wei Hu, Wei Wang, Lily Zhao |
2024-10-08 |
$22,809,000 |
| 12019242 |
Full-field metrology tool for waveguide combiners and meta-surfaces |
Jinxin FU, Ludovic Godet |
2024-06-25 |
$57,214,000 |
| 11988574 |
Illumination system for AR metrology tool |
Jinxin FU, Kazuya Daito, Ludovic Godet |
2024-05-21 |
$57,593,000 |
| 11978196 |
See-through metrology systems, apparatus, and methods for optical devices |
Jinxin FU, Kazuya Daito, Ludovic Godet |
2024-05-07 |
|
| 11948909 |
Package comprising spacers between integrated devices |
Dongming He, Lily Zhao |
2024-04-02 |
$17,562,000 |
| 11913776 |
Interference in-sensitive Littrow system for optical device structure measurement |
Jinxin FU, Ludovic Godet |
2024-02-27 |
$57,915,000 |
| 11808743 |
Ion chromatography (IC) suppressor |
Chuncheng Ding, Enlai Zhang, Xizhi Zhang |
2023-11-07 |
|
| 11748875 |
See-through metrology systems, apparatus, and methods for optical devices |
Jinxin FU, Kazuya Daito, Ludovic Godet |
2023-09-05 |
$42,922,000 |
| 11676922 |
Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer |
Li-Sheng Weng, Yue Li |
2023-06-13 |
$11,694,000 |
| 11557557 |
Flip-chip flexible under bump metallization size |
Dongming He, Lily Zhao |
2023-01-17 |
$15,190,000 |
| 11417622 |
Flip-chip device |
John Holmes, Xuefeng Zhang, Dongming He |
2022-08-16 |
$29,107,000 |
| 11380613 |
Repurposed seed layer for high frequency noise control and electrostatic discharge connection |
Yue Li, Li-Sheng Weng |
2022-07-05 |
$23,532,000 |
| 11321837 |
Fiber imaging apparatus, methods, and applications |
Shuo Pang, Jian Zhao, Axel Schulzgen |
2022-05-03 |
|
| 10711428 |
Supporting device and method for calculating jacking force thereof |
Chuntian Li, Biao Liao, Weizheng Kong, Xinyu Shao, Siyuan Zhao +1 more |
2020-07-14 |
|
| 10325979 |
High density and reliable vertical natural capacitors |
Junjing Bao, Jun Chen, Stanley Seungchul Song, Giridhar Nallapati |
2019-06-18 |
$16,719,000 |
| 9362143 |
Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages |
Michel Koopmans, Jaspreet S. Gandhi, Josh D. Woodland, Brandon P. Wirz |
2016-06-07 |
$8,315,000 |
| 9123700 |
Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias |
Jaspreet S. Gandhi, Brandon P. Wirz, Josh D. Woodland |
2015-09-01 |
$10,392,000 |
