Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381326 | Multifunctional antenna structure | Hsin-Chi Li, Sheng Lin | 2025-08-05 |
| 12062648 | Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods | Darko R. Popovic, Durodami LISK | 2024-08-13 |
| 11817406 | Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods | Durodami LISK, Jinying Sun | 2023-11-14 |
| 11676922 | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer | Li-Sheng Weng, Yangyang SUN | 2023-06-13 |
| 11380613 | Repurposed seed layer for high frequency noise control and electrostatic discharge connection | Li-Sheng Weng, Yangyang SUN | 2022-07-05 |
| 10321575 | Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components | Charles David Paynter, Ryan David Lane, Ruey Kae Zang | 2019-06-11 |
| 10231324 | Staggered power structure in a power distribution network (PDN) | Ryan David Lane, Charles David Paynter, Ruey Kae Zang | 2019-03-12 |
| 10170232 | Toroid inductor with reduced electromagnetic field leakage | Charles David Paynter, Ryan David Lane | 2019-01-01 |
| 9998085 | Waveguide | Christopher John Stevens, Christopher Chan | 2018-06-12 |
| 9263186 | DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor | Xiaoming Chen, Zhongping Bao, Charles David Paynter, Xiaonan Zhang, Ryan David Lane | 2016-02-16 |
| 9041176 | Hybrid semiconductor module structure | Charles David Paynter, Ruey Kae Zang | 2015-05-26 |
| 8012874 | Semiconductor chip substrate with multi-capacitor footprint | Silqun Leung, Terence Cheung, Sally Yeung, Liane Martinez | 2011-09-06 |