Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10321575 | Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components | Yue Li, Charles David Paynter, Ryan David Lane | 2019-06-11 |
| 10231324 | Staggered power structure in a power distribution network (PDN) | Ryan David Lane, Yue Li, Charles David Paynter | 2019-03-12 |
| 9041176 | Hybrid semiconductor module structure | Yue Li, Charles David Paynter | 2015-05-26 |
| 8952552 | Semiconductor package assembly systems and methods using DAM and trench structures | Wen-Sung Hsu | 2015-02-10 |
| 8890143 | Method to optimize and reduce integrated circuit, package design, and verification cycle time | Ryan David Lane | 2014-11-18 |