Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160952 | Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods | Biancun Xie, Shree Krishna Pandey, Chin-Kwan Kim, Charles David Paynter | 2024-12-03 |
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Li-Sheng Weng, Charles David Paynter, Jianwen Xu, William Stone | 2023-10-10 |
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Li-Sheng Weng, Charles David Paynter, Eric David Foronda | 2023-03-14 |
| 11452246 | Patch substrate configured as a shield located over a cavity of a board | Charles David Paynter, John Eaton, Amit Mano | 2022-09-20 |
| 10321575 | Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components | Yue Li, Charles David Paynter, Ruey Kae Zang | 2019-06-11 |
| 10231324 | Staggered power structure in a power distribution network (PDN) | Yue Li, Charles David Paynter, Ruey Kae Zang | 2019-03-12 |
| 10170232 | Toroid inductor with reduced electromagnetic field leakage | Yue Li, Charles David Paynter | 2019-01-01 |
| 10051741 | Embedded layered inductor | Young Kyu Song, Daeik Daniel Kim, Xiaonan Zhang, Jonghae Kim | 2018-08-14 |
| 10008316 | Inductor embedded in a package substrate | Siamak Fazelpour, Charles David Paynter | 2018-06-26 |
| 9577025 | Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device | Shiqun Gu, Glenn D. Raskin, Shree Krishna Pandey | 2017-02-21 |
| 9514966 | Apparatus and methods for shielding differential signal pin pairs | Siamak Fazelpour, Charles David Paynter | 2016-12-06 |
| 9484281 | Systems and methods for thermal dissipation | Charles David Paynter | 2016-11-01 |
| 9449762 | Embedded package substrate capacitor with configurable/controllable equivalent series resistance | Young Kyu Song, Kyu-Pyung Hwang, Dong Wook Kim, Xiaonan Zhang | 2016-09-20 |
| 9379090 | System, apparatus, and method for split die interconnection | Ahmer Syed, Chin-Kwan Kim, Omar J. Bchir, Milind Shah | 2016-06-28 |
| 9373583 | High quality factor filter implemented in wafer level packaging (WLP) integrated device | Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei-Ming Jow, Xiaonan Zhang | 2016-06-21 |
| 9368566 | Package on package (PoP) integrated device comprising a capacitor in a substrate | Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow +3 more | 2016-06-14 |
| 9362218 | Integrated passive device (IPD) on substrate | Daeik Daniel Kim, Young Kyu Song, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +2 more | 2016-06-07 |
| 9324779 | Toroid inductor in an integrated device | Young Kyu Song, Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Mario Francisco Velez +2 more | 2016-04-26 |
| 9263186 | DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor | Yue Li, Xiaoming Chen, Zhongping Bao, Charles David Paynter, Xiaonan Zhang | 2016-02-16 |
| 9245940 | Inductor design on floating UBM balls for wafer level package (WLP) | Young Kyu Song, Yunseo Park, Xiaonan Zhang, Aristotele Hadjichristos | 2016-01-26 |
| 9209131 | Toroid inductor in redistribution layers (RDL) of an integrated device | Shiqun Gu, Urmi Ray | 2015-12-08 |
| 9153560 | Package on package (PoP) integrated device comprising a redistribution layer | Charles David Paynter, David Ian West | 2015-10-06 |
| 9131634 | Radio frequency package on package circuit | Aristotele Hadjichristos, Gurkanwal Singh Sahota, Steven C. Ciccarelli, David J Wilding, Christian Holenstein +1 more | 2015-09-08 |
| 9035421 | High quality factor inductor implemented in wafer level packaging (WLP) | Young Kyu Song, Yunseo Park, Xiaonan Zhang, Babak Nejati, Aristotele Hadjichristos +1 more | 2015-05-19 |
| 8890143 | Method to optimize and reduce integrated circuit, package design, and verification cycle time | Ruey Kae Zang | 2014-11-18 |