Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341129 | Substrateless double-sided embedded multi-die interconnect bridge | Jianyong Xie, Sujit Sharan, Debendra Mallik, Robert L. Sankman | 2025-06-24 |
| 12160952 | Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods | Shree Krishna Pandey, Chin-Kwan Kim, Ryan David Lane, Charles David Paynter | 2024-12-03 |
| 11749661 | Package comprising a substrate and a multi-capacitor integrated passive device | Shree Krishna Pandey | 2023-09-05 |
| 11626359 | Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integration | Shree Krishna Pandey, Irfan Khan, Miguel MIRANDA CORBALAN, Stanley Seungchul Song | 2023-04-11 |