Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8803305 | Hybrid package construction with wire bond and through silicon vias | Ratibor Radojcic, Arvind Chandrasekaran | 2014-08-12 |
| 7728564 | Power supply for a load control device | William Bryce Fricke, Aaron Dobbins, James P. Steiner, Chen Ming Wu, Russell Weightman +3 more | 2010-06-01 |
| 7612449 | Optimized power delivery to high speed, high pin-count devices | Justin Joseph Rosen Gagne, Mark Veatch | 2009-11-03 |
| 6891275 | Method for accommodating small minimum die in wire bonded area array packages | Edward Reyes, Mark Veatch, Tom Gregorich | 2005-05-10 |
| 6762495 | Area array package with non-electrically connected solder balls | Edward Reyes, Tiona Marburger, Tom Gregorich | 2004-07-13 |