AC

Arvind Chandrasekaran

QU Qualcomm: 20 patents #1,116 of 12,104Top 10%
CU Concordia University: 1 patents #8 of 46Top 20%
PM Pmc-Sierra: 1 patents #60 of 145Top 45%
Overall (All Time): #196,662 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9252128 Panelized backside processing for thin semiconductors — 2016-02-02
9021440 System and method for automated test script generation — 2015-04-28
8912043 Dual-side interconnected CMOS for stacked integrated circuits Brian Matthew Henderson 2014-12-16
8883080 Nano-enhanced evanescence integrated technique (NEET) based microphotonic device and sample analysis system Muthukumaran Packirisamy 2014-11-11
8877563 Microfabricated pillar fins for thermal management — 2014-11-04
8803305 Hybrid package construction with wire bond and through silicon vias Ratibor Radojcic, Ryan David Lane 2014-08-12
8618539 Interconnect sensor for detecting delamination Brian Matthew Henderson, Shiqun Gu, Homyar C. Mogul, Mark M. Nakamoto 2013-12-31
8557680 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Brian Matthew Henderson 2013-10-15
8525342 Dual-side interconnected CMOS for stacked integrated circuits Brian Matthew Henderson 2013-09-03
8513089 Discontinuous thin semiconductor wafer surface features — 2013-08-20
8482125 Conductive sidewall for microbumps Shiqun Gu, Christine Hau-Riege 2013-07-09
8451581 Passive coupler between package substrate and system board Jonghae Kim 2013-05-28
8445994 Discontinuous thin semiconductor wafer surface features — 2013-05-21
8391018 Semiconductor die-based packaging interconnect Jonghae Kim 2013-03-05
8354300 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits Brian Matthew Henderson 2013-01-15
8310061 Stacked die parallel plate capacitor — 2012-11-13
8294280 Panelized backside processing for thin semiconductors — 2012-10-23
8283776 Microfabricated pillar fins for thermal management — 2012-10-09
8242543 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Brian Matthew Henderson 2012-08-14
8076762 Variable feature interface that induces a balanced stress to prevent thin die warpage Ratibor Radojcic 2011-12-13
7969009 Through silicon via bridge interconnect — 2011-06-28
7900519 Microfluidic measuring tool to measure through-silicon via depth — 2011-03-08