BH

Brian Matthew Henderson

QU Qualcomm: 22 patents #1,021 of 12,104Top 9%
BU Burroughs: 1 patents #265 of 604Top 45%
Overall (All Time): #185,005 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9379201 Electrostatic discharge diodes and methods of forming electrostatic discharge diodes Vidhya Ramachandran, Shiqun Gu, Chiew-Guan Tan, Jung Pill Kim, Taehyun Kim 2016-06-28
9190201 Magnetic film enhanced inductor Xia Li, Matthew Michael Nowak, Seung H. Kang 2015-11-17
9184130 Electrostatic protection for stacked multi-chip integrated circuits Chiew-Guan Tan, Gregory Ameriada Uvieghara, Reza Jalilizeinali 2015-11-10
9153461 Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device Shiqun Gu 2015-10-06
9093462 Electrostatic discharge diode Vidhya Ramachandran, Shiqun Gu, Chiew-Guan Tan, Jung Pill Kim, Taehyun Kim 2015-07-28
9041220 Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device Shiqun Gu 2015-05-26
8912043 Dual-side interconnected CMOS for stacked integrated circuits Arvind Chandrasekaran 2014-12-16
8618539 Interconnect sensor for detecting delamination Shiqun Gu, Homyar C. Mogul, Mark M. Nakamoto, Arvind Chandrasekaran 2013-12-31
8604626 Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly Ronnie A. Lindley, Dong Wook Kim, Reza Jalilizeinali, Shiqun Gu, Matthew Michael Nowak 2013-12-10
8557680 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Arvind Chandrasekaran 2013-10-15
8536893 Circuit for measuring magnitude of electrostatic discharge (ESD) events for semiconductor chip bonding Eugene R. Worley 2013-09-17
8525342 Dual-side interconnected CMOS for stacked integrated circuits Arvind Chandrasekaran 2013-09-03
8508301 Three dimensional inductor, transformer and radio frequency amplifier Jonghae Kim, Shiqun Gu, Thomas R. Toms, Lew G. Chua-Eoan, Seyfollah Bazarjani +1 more 2013-08-13
8362599 Forming radio frequency integrated circuits Jonghae Kim, Matthew Michael Nowak, Jiayu Xu 2013-01-29
8354300 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits Arvind Chandrasekaran 2013-01-15
8350358 Techniques for placement of active and passive devices within a chip Jonghae Kim, Shiqun Gu, Thomas R. Toms, Matthew Michael Nowak 2013-01-08
8324066 Techniques for placement of active and passive devices within a chip Jonghae Kim, Shiqun Gu, Thomas R. Toms, Matthew Michael Nowak 2012-12-04
8319325 Intra-die routing using back side redistribution layer and associated method Chandra Sekhar Nimmagadda 2012-11-27
8242543 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Arvind Chandrasekaran 2012-08-14
8198736 Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly Reza Jalilizeinali, Shiqun Gu 2012-06-12
8143952 Three dimensional inductor and transformer Jonghae Kim, Shiqun Gu, Thomas R. Toms, Lew G. Chua-Eoan, Seyfollah Bazarjani +1 more 2012-03-27
8067816 Techniques for placement of active and passive devices within a chip Jonghae Kim, Shiqun Gu, Thomas R. Toms, Matthew Michael Nowak 2011-11-29
4647850 Integrated circuit for measuring mask misalignment Alan M. Gundlach, Anthony John Walton 1987-03-03