Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8604626 | Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly | Brian Matthew Henderson, Dong Wook Kim, Reza Jalilizeinali, Shiqun Gu, Matthew Michael Nowak | 2013-12-10 |