Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971476 | Bottom package with metal post interconnections | Shiqun Gu, Dong Wook Kim | 2021-04-06 |
| 9881859 | Substrate block for PoP package | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Shiqun Gu | 2018-01-30 |
| 9869713 | Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems | Sung Kyu Lim, Yang Du | 2018-01-16 |
| 9853446 | Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection | Shiqun Gu, Eugene R. Worley, Urmi Ray | 2017-12-26 |
| 9704796 | Integrated device comprising a capacitor that includes multiple pins and at least one pin that traverses a plate of the capacitor | Shiqun Gu, Shree Krishna Pandey | 2017-07-11 |
| 9633977 | Integrated device comprising flexible connector between integrated circuit (IC) packages | Hong Bok We, Shiqun Gu, Urmi Ray | 2017-04-25 |
| 9418877 | Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers | Shiqun Gu, Dong Wook Kim, Jae Sik Lee | 2016-08-16 |
| 9285418 | Method and apparatus for characterizing thermal marginality in an integrated circuit | Tapan Jyoti Chakraborty, Rajamani Sethuram | 2016-03-15 |
| 9136202 | Enhanced package thermal management using external and internal capacitive thermal material | Victor A. Chiriac, Durodami LISK | 2015-09-15 |
| 8803305 | Hybrid package construction with wire bond and through silicon vias | Arvind Chandrasekaran, Ryan David Lane | 2014-08-12 |
| 8691707 | Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection | Shiqun Gu, Yiming Li | 2014-04-08 |
| 8633562 | Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection | Shiqun Gu, Yiming Li | 2014-01-21 |
| 8076762 | Variable feature interface that induces a balanced stress to prevent thin die warpage | Arvind Chandrasekaran | 2011-12-13 |