Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243855 | Package comprising channel interconnects located between solder interconnects | Aniket PATIL, Hong Bok We, Charles David Paynter | 2025-03-04 |
| 12062648 | Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods | Darko R. Popovic, Yue Li | 2024-08-13 |
| 11817406 | Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods | Yue Li, Jinying Sun | 2023-11-14 |
| 9165791 | Wireless interconnects in an interposer | Xiaoxia Wu, Yunqiang Yang, Chengjie Zuo | 2015-10-20 |
| 9136202 | Enhanced package thermal management using external and internal capacitive thermal material | Victor A. Chiriac, Ratibor Radojcic | 2015-09-15 |