Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062648 | Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods | Durodami LISK, Yue Li | 2024-08-13 |
| 10263380 | Crosstalk reduction in electrical interconnects | — | 2019-04-16 |
| 9755391 | Crosstalk reduction in electrical interconnects | — | 2017-09-05 |
| 8390109 | Chip package with plank stack of semiconductor dies | Matthew Giere, Bruce M. Guenin, Theresa Y. Sze, Ivan Shubin, John A. Harada +2 more | 2013-03-05 |
| 7863743 | Capactive connectors with enhanced capacitive coupling | Jing Shi, Ashok V. Krishnamoorthy | 2011-01-04 |