Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10591689 | Reflow-compatible optical I/O assembly adapter | Chaoqi Zhang, Hiren D. Thacker, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2020-03-17 |
| 10514502 | Back-side etching and cleaving of substrates | Jin Hyoung Lee, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2019-12-24 |
| 9871346 | Mode-hop-free hybrid external-cavity laser with passive thermo-optic coefficient compensation | Jin Hyoung Lee, Xuezhe Zheng, Jock T. Bovington, Ashok V. Krishnamoorthy | 2018-01-16 |
| 9829626 | Hybrid-integrated multi-chip module | Xuezhe Zheng, Jin Hyoung Lee, Ashok V. Krishnamoorthy | 2017-11-28 |
| 9812842 | Hybrid optical source with optical proximity coupling provided by an external reflector | Xuezhe Zheng, Jin Yao, Jin Hyoung Lee, Jock T. Bovington, Shiyun Lin +1 more | 2017-11-07 |
| 9696486 | Surface-normal coupler for silicon-on-insulator platforms | Xuezhe Zheng, John E. Cunningham, Ashok V. Krishnamoorthy | 2017-07-04 |
| 9698564 | Hybrid integrated MCM with waveguide-fiber connector | Xuezhe Zheng, Jin Hyoung Lee, Ashok V. Krishnamoorthy | 2017-07-04 |
| 9618709 | Hybrid integration of edge-coupled chips | Xuezhe Zheng, Ying Luo, Guoliang Li, Ashok V. Krishnamoorthy | 2017-04-11 |
| 9575251 | Optical mode converter having multiple regions | Jin Hyoung Lee, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2017-02-21 |
| 9519105 | Self-assembled vertically aligned multi-chip module | Xuezhe Zheng, Jin Hyoung Lee, Kannan Raj, Ashok V. Krishnamoorthy | 2016-12-13 |
| 9488777 | Back-side etching and cleaving of substrates | Jin Hyoung Lee, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2016-11-08 |
| 9470855 | Self-assembled vertically aligned multi-chip module | Xuezhe Zheng, Jin Hyoung Lee, Kannan Raj, Ashok V. Krishnamoorthy | 2016-10-18 |
| 9465169 | Single shot correction of resonant optical components | Stevan S. Djordjevic, Shiyun Lin, Xuezhe Zheng, John E. Cunningham, Ashok V. Krishnamoorthy | 2016-10-11 |
| 9411177 | Integrated electro-absorption modulator | John E. Cunningham, Jin Yao, Guoliang Li, Xuezhe Zheng, Shiyun Lin +3 more | 2016-08-09 |
| 9297971 | Hybrid-integrated photonic chip package with an interposer | Hiren D. Thacker, Ashok V. Krishnamoorthy, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng +2 more | 2016-03-29 |
| 9281268 | Method for fabricating multi-chip module with multi-level interposer | Eugene M. Chow, John E. Cunningham, James G. Mitchell | 2016-03-08 |
| 9250403 | Hybrid-integrated photonic chip package with an interposer | Hiren D. Thacker, Frankie Y. Liu, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng +4 more | 2016-02-02 |
| 9164231 | Ultra-compact photodetector on an optical waveguide | John E. Cunningham | 2015-10-20 |
| 9142698 | Integrated electro-absorption modulator | John E. Cunningham, Jin Yao, Guoliang Li, Xuezhe Zheng, Shiyun Lin +3 more | 2015-09-22 |
| 8988770 | Hybrid optical source with semiconductor reflector | Xuezhe Zheng, Ashok V. Krishnamoorthy, John E. Cunningham, Guoliang Li, Ying Luo | 2015-03-24 |
| 8982563 | Chip package to support high-frequency processors | Kannan Raj, John E. Cunningham | 2015-03-17 |
| 8971674 | Optical device with high thermal tuning efficiency | John E. Cunningham, Xuezhe Zheng, Guoliang Li, Ashok V. Krishnamoorthy | 2015-03-03 |
| 8796811 | Hybrid substrateless device with enhanced tuning efficiency | Ashok V. Krishnamoorthy, John E. Cunningham | 2014-08-05 |
| 8772920 | Interconnection and assembly of three-dimensional chip packages | Hiren D. Thacker, John E. Cunningham, Ashok V. Krishnamoorthy | 2014-07-08 |
| 8742576 | Maintaining alignment in a multi-chip module using a compressible structure | Hiren D. Thacker, Hyung Suk Yang, John E. Cunningham | 2014-06-03 |