Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10591689 | Reflow-compatible optical I/O assembly adapter | Chaoqi Zhang, Ivan Shubin, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2020-03-17 |
| 9933574 | Waveguide-last silicon photonic optical connector assembly | Chaoqi Zhang, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2018-04-03 |
| 9819421 | Extracting an embedded DC signal to provide a reference voltage for an optical receiver | Jingqiong Xie, Ashok V. Krishnamoorthy, Xuezhe Zheng, Jeffrey W. Denq, Kannan Raj +1 more | 2017-11-14 |
| 9678271 | Packaged opto-electronic module | Ashok V. Krishnamoorthy, Xuezhe Zheng, John E. Cunningham | 2017-06-13 |
| 9411177 | Integrated electro-absorption modulator | John E. Cunningham, Jin Yao, Ivan Shubin, Guoliang Li, Xuezhe Zheng +3 more | 2016-08-09 |
| 9297971 | Hybrid-integrated photonic chip package with an interposer | Ashok V. Krishnamoorthy, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng, Ronald Ho +2 more | 2016-03-29 |
| 9256026 | Hybrid integrated photonic chip package | Ashok V. Krishnamoorthy, Robert D. Hopkins, Jon Lexau, Ronald Ho, John E. Cunningham | 2016-02-09 |
| 9250403 | Hybrid-integrated photonic chip package with an interposer | Frankie Y. Liu, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng, Guoliang Li +4 more | 2016-02-02 |
| 9217836 | Edge coupling of optical devices | Mehdi Asghari, Roshanak Shafiiha, Daniel Lee, Dazeng Feng, Xuezhe Zheng +2 more | 2015-12-22 |
| 9159861 | Method for singulating hybrid integrated photonic chips | Chaoqi Zhang, Ashok V. Krishnamoorthy | 2015-10-13 |
| 9142698 | Integrated electro-absorption modulator | John E. Cunningham, Jin Yao, Ivan Shubin, Guoliang Li, Xuezhe Zheng +3 more | 2015-09-22 |
| 9136237 | Electroplated solder for high-temperature interconnect | John E. Cunningham | 2015-09-15 |
| 9082808 | Batch process for three-dimensional integration | Ashok V. Krishnamoorthy, John E. Cunningham | 2015-07-14 |
| 8998509 | Stackable photonic interconnect module | Xuezhe Zheng, Ashok V. Krishnamoorthy, Gary L. Gilbert | 2015-04-07 |
| 8975754 | Chip package for high-count chip stacks | John E. Cunningham, Ashok V. Krishnamoorthy | 2015-03-10 |
| 8971676 | Hybrid-integrated photonic chip package | Ashok V. Krishnamoorthy, Robert D. Hopkins, Jon Lexau, Ronald Ho, John E. Cunningham | 2015-03-03 |
| 8896112 | Multi-chip module with self-populating positive features | Ashok V. Krishnamoorthy, John E. Cunningham, Chaoqi Zhang | 2014-11-25 |
| 8772920 | Interconnection and assembly of three-dimensional chip packages | John E. Cunningham, Ivan Shubin, Ashok V. Krishnamoorthy | 2014-07-08 |
| 8742576 | Maintaining alignment in a multi-chip module using a compressible structure | Hyung Suk Yang, Ivan Shubin, John E. Cunningham | 2014-06-03 |
| 8648463 | Assembly of multi-chip modules with proximity connectors using reflowable features | Jing Shi, John E. Cunningham, Ashok V. Krishnamoorthy | 2014-02-11 |
| 8600201 | Optical device with enhanced mechanical strength | Ivan Shubin, John E. Cunningham | 2013-12-03 |
| 8548288 | Efficient inter-chip optical coupling | Kannan Raj, John E. Cunningham | 2013-10-01 |
| 8548287 | Direct interlayer optical coupler | Xuezhe Zheng, Ivan Shubin, Kannan Raj, John E. Cunningham, Ashok V. Krishnamoorthy | 2013-10-01 |
| 8334149 | Mechanical coupling in a multi-chip module using magnetic components | Jing Shi, Ashok V. Krishnamoorthy, John E. Cunningham | 2012-12-18 |
| 8315065 | Self-locking features in a multi-chip module | Jing Shi, Ashok V. Krishnamoorthy | 2012-11-20 |