Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243841 | Electronic component embedded substrate and circuit module using the same | Toshiyuki Abe, Yoshihiro Suzuki, Hironori Chiba, Tetsuya Yazaki | 2025-03-04 |
| 9635756 | Circuit board incorporating semiconductor IC and manufacturing method thereof | Kazutoshi TSUYUTANI, Yoshihiro Suzuki, Tsuyoshi Mochizuki | 2017-04-25 |
| 8303752 | Method of manufacturing wiring board | Kenichi Kawabata | 2012-11-06 |
| 6908960 | COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN | Minoru Takaya, Hisashi Kobuke, Toshikazu Endo, Seiji Takahara, Toshiyuki Abe +2 more | 2005-06-21 |
| 6407020 | Ceramics composition | Toshio Sakurai | 2002-06-18 |