Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12240751 | Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method | Yoshihiro Suzuki | 2025-03-04 |
| 12125754 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Yoshihiro Suzuki, Akira MOTOHASHI | 2024-10-22 |
| 11682628 | Semiconductor IC-embedded substrate having heat dissipation structure and its manufacturing method | Masashi Katsumata, Yoshihiro Suzuki | 2023-06-20 |
| 11462447 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Yoshihiro Suzuki, Akira MOTOHASHI | 2022-10-04 |
| 11393761 | Circuit board and its manufacturing method | Yoshihiro Suzuki | 2022-07-19 |
| 11053118 | Sensor package substrate and sensor module having the same | Yoshihiro Suzuki | 2021-07-06 |
| 10917974 | Circuit board incorporating electronic component and manufacturing method thereof | — | 2021-02-09 |
| 10515898 | Circuit board incorporating semiconductor IC and manufacturing method thereof | Masashi Katsumata | 2019-12-24 |
| 9635756 | Circuit board incorporating semiconductor IC and manufacturing method thereof | Hiroshige Ohkawa, Yoshihiro Suzuki, Tsuyoshi Mochizuki | 2017-04-25 |
| 9153553 | IC embedded substrate and method of manufacturing the same | Masashi Katsumata | 2015-10-06 |
| 8779299 | Electronic component-embeded board and method for manufacturing the same | Yoshihiro Suzuki | 2014-07-15 |