TE

Toshikazu Endo

Tdk: 11 patents #551 of 3,796Top 15%
LS Lattice Semiconductor: 4 patents #136 of 544Top 25%
PA Panasonic: 2 patents #9,678 of 21,108Top 50%
MG Mentor Graphics: 1 patents #345 of 698Top 50%
📍 Tokyo, CA: #322 of 583 inventorsTop 60%
Overall (All Time): #257,837 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
8742589 Semiconductor embedded module and method for producing the same Kenichi Kawabata 2014-06-03
8572525 Partition response surface modeling Marko P. Chew, Yue Yang 2013-10-29
8523410 Light source device with thermal dissipating members Naotaka Hashimoto, Shinya Kawagoe 2013-09-03
8414163 Light source apparatus Naotaka Hashimoto, Shinya Kawagoe, Kuninori Takezawa 2013-04-09
8286116 Composite wire indexing for programmable logic devices Byung-Kyoo Kang, Guanqun Zhou 2012-10-09
8104009 Wire mapping for programmable logic devices Byung-Kyoo Kang 2012-01-24
7890913 Wire mapping for programmable logic devices Byung-Kyoo Kang 2011-02-15
7812444 Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein Masashi Katsumata, Kenichi Kawabata 2010-10-12
7788623 Composite wire indexing for programmable logic devices Byung-Kyoo Kang, Guanqun Zhou 2010-08-31
7733600 Hard disk drive and wireless data terminal using the same Kenichi Kawabata 2010-06-08
7547975 Module with embedded semiconductor IC and method of fabricating the module Minoru Takaya, Hisayuki Abe, Kei Suzuki, Kosuke Takano, Kenichi Kawabata 2009-06-16
7167071 Inductive device and method for producing the same Minoru Takaya, Takashi Kajino, Hisashi Kobuke, Masami Sasaki, Kazuhiko Itoh 2007-01-23
7081803 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module Minoru Takaya 2006-07-25
7060350 COMPOSITE MAGNETIC MATERIAL AND MAGNETIC MOLDING MATERIAL, MAGNETIC POWDER COMPRESSION MOLDING MATERIAL, AND MAGNETIC PAINT USING THE COMPOSITE MAGNETIC MATERIAL, COMPOSITE DIELECTRIC MATERIAL AND MOLDING MATERIAL, POWDER COMPRESSION MOLDING MATERIAL, PAINT, PREPREG, AND SUBSTRATE USING THE COMPOSITE DIELECTRIC MATERIAL, AND ELECTRONIC PART Minoru Takaya, Yoshiaki Akachi, Hisashi Kobuke 2006-06-13
6908960 COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN Minoru Takaya, Hisashi Kobuke, Seiji Takahara, Toshiyuki Abe, Hiroshige Ohkawa +2 more 2005-06-21
6808642 Method for producing multilayer substrate and electronic part, and multilayer electronic part Minoru Takaya, Masami Sasaki 2004-10-26
6749928 Electronic parts and method producing the same Minoru Takaya 2004-06-15
6713162 Electronic parts Minoru Takaya 2004-03-30