Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869834 | Electroconductive substrate, electronic device and display device | Takashi Daitoku, Susumu Taniguchi, Akiko SEKI, Atsushi Sato, Yuhei Horikawa +1 more | 2024-01-09 |
| 11668008 | Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor | Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi | 2023-06-06 |
| 11466368 | Sheet material, metal mesh and manufacturing methods thereof | Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi, Hiroki Ashizawa, Miho Mori +1 more | 2022-10-11 |
| 11410855 | Method of producing electroconductive substrate, electronic device and display device | Takashi Daitoku, Susumu Taniguchi, Akiko SEKI, Atsushi Sato, Yuhei Horikawa +1 more | 2022-08-09 |
| 11031330 | Electroconductive substrate, electronic device and display device | Takashi Daitoku, Susumu Taniguchi, Akiko SEKI, Atsushi Sato, Yuhei Horikawa +1 more | 2021-06-08 |
| 10968519 | Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor | Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi | 2021-04-06 |
| 10867898 | Electroconductive substrate, electronic device and display device | Takashi Daitoku, Susumu Taniguchi, Akiko SEKI, Atsushi Sato, Yuhei Horikawa +1 more | 2020-12-15 |
| 10784122 | Method of producing electroconductive substrate, electronic device and display device | Takashi Daitoku, Susumu Taniguchi, Akiko SEKI, Atsushi Sato, Yuhei Horikawa +1 more | 2020-09-22 |
| 10392704 | Coating electronic component | Kenichi Yoshida, Yuhei Horikawa, Atsushi Sato | 2019-08-27 |
| 10374301 | Wiring component | Yuhei Horikawa, Makoto Orikasa, Yoshihiro Kanbayashi, Hirohumi Asou, Kosuke Kunitsuka | 2019-08-06 |
| 10362686 | Lead-free solder and electronic component built-in module | Tsutomu Yasui, Kenichi Kawabata, Tomoko Kitamura | 2019-07-23 |
| 10354796 | Method for manufacturing planar coil | Yuhei Horikawa, Makoto Orikasa, Yoshihiro Kanbayashi, Hirohumi Asou, Kosuke Kunitsuka | 2019-07-16 |
| 10354973 | Method for producing semiconductor chip | Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2019-07-16 |
| 10304779 | Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof | Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi | 2019-05-28 |
| 10205250 | Junction structure for an electronic device and electronic device | Kenichi Yoshida, Yuhei Horikawa | 2019-02-12 |
| 10163847 | Method for producing semiconductor package | Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2018-12-25 |
| D816639 | Microphone for wireless communications device | — | 2018-05-01 |
| 9818736 | Method for producing semiconductor package | Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2017-11-14 |
| 9768154 | Semiconductor package and manufacturing method therefor | Toshio Tomonari, Hirohumi Asou | 2017-09-19 |
| D796467 | Portable wireless communication device | Miki Oikawa, Katsuhiro Moriya, Toyohito Yamamoto | 2017-09-05 |
| 9640500 | Terminal structure and semiconductor device | Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2017-05-02 |
| 9620156 | Magnetic head device | Katsuhiko Igarashi, Makoto Orikasa, Takashi Kawashima | 2017-04-11 |
| 9564179 | Rectifying component for magnetic disk device | Susumu Taniguchi | 2017-02-07 |
| 9320146 | Electronic circuit module component | Miyuki Yanagida | 2016-04-19 |
| 9293421 | Electronic component module | Miyuki Yanagida, Makoto Orikasa, Susumu Taniguchi | 2016-03-22 |