Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257402 | Terminal structure, and semiconductor element and module substrate comprising the same | Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2016-02-09 |
| 9258905 | Lead-free solder and electronic component built-in module | Tsutomu Yasui, Kenichi Kawabata, Tomoko Kitamura | 2016-02-09 |
| 9144166 | Electronic component | Miyuki Yanagida | 2015-09-22 |
| 9070606 | Terminal structure and semiconductor device | Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2015-06-30 |
| 8970037 | Terminal structure, and semiconductor element and module substrate comprising the same | Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2015-03-03 |
| 8787028 | Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure | Yuhei Horikawa, Shin Fujita, Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike | 2014-07-22 |
| 8553390 | Ceramic electronic component | Susumu Taniguchi, Miyuki Yanagida, Yukari Inoue, Masataka Kitagami | 2013-10-08 |
| 8449696 | Rare-earth sintered magnet containing a nitride, rotator containing rare-earth sintered magnet, and reciprocating motor containing rare-earth sintered magnet | Kenichi Yoshida, Hiroshi Yamamoto | 2013-05-28 |
| 8383964 | Terminal structure, printed wiring board, module substrate, and electronic device | Atsushi Sato, Takashi Ota, Miyuki Yanagida, Masumi Kameda | 2013-02-26 |
| 8291585 | Method for manufacturing electronic component | Ko Onodera, Satoshi Kurimoto, Taketo Sasaki, Yoji Tozawa, Osamu Hirose | 2012-10-23 |
| 8254083 | Ceramic electronic component and method for producing same | Takashi Sakurai, Shinya Yoshihara, Ko Onodera, Masahiko Konno, Satoshi Kurimoto +4 more | 2012-08-28 |
| 8183463 | Plating film, printed wiring board, and module substrate | Atsushi Sato, Takashi Ota, Miyuki Yanagida, Masumi Kameda | 2012-05-22 |
| D644621 | Radio two-way communications device | — | 2011-09-06 |
| 8009012 | Stacked electronic part and method of manufacturing the same | Takashi Kajino, Akira Kakinuma, Kazuhiko Itoh | 2011-08-30 |
| 7868464 | Multilayer substrate and manufacturing method thereof | Kenichi Kawabata, Masashi Katsumata | 2011-01-11 |
| 7547975 | Module with embedded semiconductor IC and method of fabricating the module | Minoru Takaya, Kei Suzuki, Kosuke Takano, Kenichi Kawabata, Toshikazu Endo | 2009-06-16 |
| 6915944 | Soldering flux, solder paste and method of soldering | Minoru Takaya | 2005-07-12 |
| 6568054 | Method of producing a multilayer electronic part | Shuumi Kumagai, Kouzou Sasaki, Makoto Kobayashi, Noriyuki Saito, Toru Takahashi +1 more | 2003-05-27 |
| 6402013 | Thermosetting soldering flux and soldering process | Toshihiko Taguchi, Yuji Kawamata, Akiko Iwano | 2002-06-11 |
| 6147573 | Multilayer electronic part with planar terminal electrodes | Shuumi Kumagai, Kouzou Sasaki, Makoto Kobayashi, Noriyuki Saito, Toru Takahashi +1 more | 2000-11-14 |
| 6008151 | Non-magnetic ceramics and ceramic multilayer parts | Masami Sasaki, Hiroshige Okawa, Yasuyoshi Suzuki, Hideki Masuda, Akira Suda | 1999-12-28 |