Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354973 | Method for producing semiconductor chip | Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2019-07-16 |
| 10163847 | Method for producing semiconductor package | Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2018-12-25 |
| 9818736 | Method for producing semiconductor package | Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2017-11-14 |
| 9640500 | Terminal structure and semiconductor device | Kenichi Yoshida, Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2017-05-02 |
| 9257402 | Terminal structure, and semiconductor element and module substrate comprising the same | Kenichi Yoshida, Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2016-02-09 |
| 9177687 | Coating and electronic component | Kenichi Yoshida, Yuhei Horikawa, Makoto Orikasa | 2015-11-03 |
| 9070606 | Terminal structure and semiconductor device | Kenichi Yoshida, Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2015-06-30 |
| 8970037 | Terminal structure, and semiconductor element and module substrate comprising the same | Kenichi Yoshida, Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2015-03-03 |
| 8933336 | Coating and electronic component | Kenichi Yoshida, Yuhei Horikawa, Makoto Orikasa | 2015-01-13 |
| 8787028 | Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure | Yuhei Horikawa, Shin Fujita, Kenichi Yoshida, Hisayuki Abe, Makoto Orikasa | 2014-07-22 |