Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12194573 | Solder paste | Hiroyoshi Kawasaki, Masato Shiratori | 2025-01-14 |
| 12031579 | Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing method | Naoki Sato, Toshio Hakuto, Takashi Akagawa, Ryoichi Suzuki, Takashi Saito +2 more | 2024-07-09 |
| 11889042 | Information processing apparatus, information processing system, fee management method, and recording medium that transmits usage fee in response to detecting that first and second users belong to a same group | Nekka Matsuura | 2024-01-30 |
| 11826860 | Flux and solder paste | Hiroyoshi Kawasaki, Masato Shiratori, Kazuhiro Minegishi | 2023-11-28 |
| 11819955 | Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device | Hiroyoshi Kawasaki, Masato Shiratori | 2023-11-21 |
| 11813686 | Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate | Hiroyoshi Kawasaki, Masato Shiratori | 2023-11-14 |
| 11571770 | Solder alloy, solder paste, solder ball, solder preform, and solder joint | Hiroyoshi Kawasaki, Masato Shiratori | 2023-02-07 |
| 11492223 | Sheet conveying device and image forming apparatus incorporating the sheet conveying device | Kazuto SHIBUYA | 2022-11-08 |
| 11377715 | Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit | Hiroyoshi Kawasaki, Masato Shiratori | 2022-07-05 |
| 10888957 | Soldering material | Hiroyoshi Kawasaki, Tomoaki Nishino, Takahiro Roppongi, Isamu Sato | 2021-01-12 |
| 10811376 | Cu column, Cu core column, solder joint, and through-silicon via | Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2020-10-20 |
| 10675719 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Takashi Hagiwara +3 more | 2020-06-09 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori +4 more | 2020-04-07 |
| 10173287 | Solder material, solder joint, and method of manufacturing the solder material | Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2019-01-08 |
| 10147695 | Cu core ball | Hiroyoshi Kawasaki, Tomohiko Hashimoto, Atsushi Ikeda, Takahiro Roppongi, Daisuke Soma +1 more | 2018-12-04 |
| 9227258 | Lead-free solder alloy having reduced shrinkage cavities | Minoru Ueshima, Min-Kyu Kang, Kayako Nakagawa, Yasuaki Kokubu | 2016-01-05 |
| 9073154 | Flux for lead-free solder and soldering method | Takashi Hagiwara, Hiroyuki Yamada, Kazuyuki Hamamoto | 2015-07-07 |
| 8888932 | Indium-containing lead-free solder for vehicle-mounted electronic circuits | Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto | 2014-11-18 |
| 8845826 | Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder | Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto | 2014-09-30 |
| 6402013 | Thermosetting soldering flux and soldering process | Hisayuki Abe, Toshihiko Taguchi, Akiko Iwano | 2002-06-11 |
| 5932030 | Flux for soldering using solder preforms | Hiroyuki Fukasawa | 1999-08-03 |