Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Hiroki Sudo, Hiroshi Okada, Daisuke Soma, Takashi Akagawa +4 more | 2022-05-31 |
| 10888957 | Soldering material | Hiroyoshi Kawasaki, Tomoaki Nishino, Isamu Sato, Yuji Kawamata | 2021-01-12 |
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima +1 more | 2021-01-12 |
| 10811376 | Cu column, Cu core column, solder joint, and through-silicon via | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato, Yuji Kawamata | 2020-10-20 |
| 10717157 | Solder material, solder paste, solder preform, solder joint and method of managing the solder material | Takahiro Hattori, Hiroyoshi Kawasaki, Hiroshi Okada, Daisuke Soma, Isamu Sato | 2020-07-21 |
| 10675719 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Takashi Hagiwara, Daisuke Soma +3 more | 2020-06-09 |
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima +1 more | 2020-05-05 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori +4 more | 2020-04-07 |
| 10381319 | Core material, semiconductor package, and forming method of bump electrode | Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Daisuke Soma +1 more | 2019-08-13 |
| 10370771 | Method of manufacturing cu core ball | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato | 2019-08-06 |
| 10322472 | Cu core ball, solder paste, formed solder, Cu core column, and solder joint | Takahiro Hattori, Daisuke Soma, Isamu Sato | 2019-06-18 |
| 10173287 | Solder material, solder joint, and method of manufacturing the solder material | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato, Yuji Kawamata | 2019-01-08 |
| 10150185 | Method for producing metal ball, joining material, and metal ball | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato | 2018-12-11 |
| 10147695 | Cu core ball | Hiroyoshi Kawasaki, Tomohiko Hashimoto, Atsushi Ikeda, Daisuke Soma, Isamu Sato +1 more | 2018-12-04 |
| 10137535 | Cu ball, Cu core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Daisuke Soma, Isamu Sato | 2018-11-27 |
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki +2 more | 2017-10-31 |
| 9668358 | Cu ball | Hiroyoshi Kawasaki, Takahiro Hattori, Daisuke Soma, Isamu Sato | 2017-05-30 |
| 9278409 | Core ball, solder paste, formed-solder, flux-coated core ball and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Daisuke Soma, Isamu Sato | 2016-03-08 |
| 9266196 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | Takashi Akagawa, Hiroyoshi Kawasaki, Kazuhiko Matsui, Yuichi Koikeda, Masaru Sasaki +3 more | 2016-02-23 |
| RE45537 | Coated solder spheres and method for producing the same | Daisuke Sohma | 2015-06-02 |
| 7750475 | Lead-free solder ball | Daisuke Souma, Hiroshi Okada, Hiromi Kawamata | 2010-07-06 |
| 7282175 | Lead-free solder | Masazumi Amagai, Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima +4 more | 2007-10-16 |
| 7132020 | Solder for use on surfaces coated with nickel by electroless plating | Iwao Nozawa, Takashi Hori, Daisuke Soma | 2006-11-07 |
| 6387499 | Coated solder spheres and method for producing the same | Daisuke Sohma | 2002-05-14 |