Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11872656 | Core material, electronic component and method for forming bump electrode | Masato Tsuchiya, Hiroki Sudo, Hiroshi Okada, Daisuke Souma | 2024-01-16 |
| 11495566 | Core material, electronic component and method for forming bump electrode | Masato Tsuchiya, Hiroyuki Iwamoto, Hiroshi Okada, Daisuke Souma | 2022-11-08 |
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2021-01-12 |
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2020-05-05 |