Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11872656 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Masato Tsuchiya, Hiroki Sudo, Hiroshi Okada | 2024-01-16 |
| 11495566 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Masato Tsuchiya, Hiroyuki Iwamoto, Hiroshi Okada | 2022-11-08 |
| 11478869 | Method for forming bump electrode substrate | Takahiro Hattori, Hiroki Sudo, Hiroshi Okada | 2022-10-25 |
| 8434614 | Storing package unit and a storing method for micro solder spheres | Isamu Sato, Kazuo Fujikura | 2013-05-07 |
| 7750475 | Lead-free solder ball | Takahiro Roppongi, Hiroshi Okada, Hiromi Kawamata | 2010-07-06 |
| 7282175 | Lead-free solder | Masazumi Amagai, Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima +4 more | 2007-10-16 |