Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119131 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Jinting Jiu, Katsuaki Suganuma, Wanli Li | 2024-10-15 |
| 11331759 | Solder alloy for power devices and solder joint having a high current density | Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma | 2022-05-17 |
| 11217359 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Jinting Jiu, Katsuaki Suganuma, Wanli Li | 2022-01-04 |
| 11024598 | Metallic sintered bonding body and die bonding method | Tetsu Takemasa | 2021-06-01 |
| 10968932 | Soldered joint and method for forming soldered joint | Yoshie Tachibana | 2021-04-06 |
| 10658107 | Method of manufacturing permanent magnet | Daisuke SAKUMA, Kazuaki Haga, Takaaki Takahashi, Takashi Akagawa, Yoshie Tachibana | 2020-05-19 |
| 10354944 | Method for soldering surface-mount component and surface-mount component | Minoru Toyoda | 2019-07-16 |
| 10297539 | Electronic device including soldered surface-mount component | Minoru Toyoda | 2019-05-21 |
| 10272527 | Solder alloy, and LED module | Takeshi Sakamoto, Rei Fujimaki | 2019-04-30 |
| 10265807 | Solder alloy and module | Takeshi Sakamoto, Rei Fujimaki | 2019-04-23 |
| 10090268 | Method of forming solder bump, and solder bump | Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Tohru Kurushima | 2018-10-02 |
| 9807889 | Method of mounting electronic component to circuit board | Kozo Fujimoto, Shinji Fukumoto, Michiya Matsushima, Satoshi Watanabe, Takeshi Kan +2 more | 2017-10-31 |
| 9796053 | High-temperature lead-free solder alloy | Rei Fujimaki | 2017-10-24 |
| 9487846 | Electroconductive bonding material | Isamu Osawa | 2016-11-08 |
| 9227258 | Lead-free solder alloy having reduced shrinkage cavities | Yuji Kawamata, Min-Kyu Kang, Kayako Nakagawa, Yasuaki Kokubu | 2016-01-05 |
| 9205513 | Bi—Sn based high-temperature solder alloy | Yoshimi Inagawa, Minoru Toyoda | 2015-12-08 |
| 9185812 | Lead-free solder paste | — | 2015-11-10 |
| 9162324 | Solder paste and solder joint | Kosuke Nakano, Hidekiyo Takaoka | 2015-10-20 |
| 8975757 | Lead-free solder connection structure and solder ball | Masayuki Suzuki, Yoshie Yamanaka, Shunsaku Yoshikawa, Tokuro Yamaki, Tsukasa Ohnishi | 2015-03-10 |
| 8888932 | Indium-containing lead-free solder for vehicle-mounted electronic circuits | Yuji Kawamata, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto | 2014-11-18 |
| 8865062 | High-temperature lead-free solder alloy | Rei Fujimaki | 2014-10-21 |
| 8845826 | Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder | Yuji Kawamata, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto | 2014-09-30 |
| 8790472 | Process for producing a solder preform having high-melting metal particles dispersed therein | Takashi Ishii | 2014-07-29 |
| 8343383 | Anisotropic conductive material | — | 2013-01-01 |
| 8334598 | Power semiconductor device and manufacturing method therefor | Hiroshi Nishibori, Kunihiro Yoshihara | 2012-12-18 |