Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710580 | Electrically conductive paste and sintered body | Jinting Jiu, Junko Seino | 2023-07-25 |
| 11628519 | Solder joint | Ko Inaba, Tadashi Kosuga | 2023-04-18 |
| 11097379 | Solder bonding method and solder joint | Ko Inaba, Tadashi Kosuga | 2021-08-24 |
| 11024598 | Metallic sintered bonding body and die bonding method | Minoru Ueshima | 2021-06-01 |